Seok-Hee Lee Appointed At Intel To Lead Foundry Packaging Operations

Intel has appointed Seok-Hee Lee as Executive Vice President (EVP) of its Foundry Business, placing him in charge of the company’s advanced packaging and back-end manufacturing operations.

Lee is a semiconductor industry executive with experience across technology, manufacturing, and energy sectors. He most recently served as President and CEO of SK On and previously held leadership positions at Solidigm, including Executive Chairman and Technology Advisor. He has also contributed to talent development through the Korea Semiconductor Academy. He holds a PhD from Stanford University.

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